TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 1 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ambient light sensor in 0805 package description TEMT6200FX01 ambient light sensor is a silicon npn epitaxial planar phototransistor in a miniature transparent 0805 package for surface mounting. it is sensitive to visible light much like the human eye and has peak sensitivity at 550 nm. features ? package type: surface mount ? package form: 0805 ? dimensions (l x w x h in mm): 2 x 1.25 x 0.85 ? aec-q101 qualified ? high photo sensitivity ? adapted to human eye responsivity ? supression filter for near infrared radiation ? angle of half sensitivity: ? = 60 ? floor life: 168 h, msl 3, acc. j-std-020 ? lead (pb)-free re flow soldering ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? automotive sensors ? ambient light sensor for display backlight dimming in: - mobile phones - notebook computers -pdas - cameras - dashboards note ? test condition see table basic characteristics note ? moq: minimum order quantity product summary component i pce (a) ? (deg) 0.5 (nm) TEMT6200FX01 23 60 450 to 610 ordering information ordering code packaging remarks package form TEMT6200FX01 tape and reel moq: 3000 pcs, 3000 pcs/reel. label with i pce group on each reel. specifications of group a/b/c see table type dedicated characteristics 0805 absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit collector emitter voltage v ceo 6v emitter collector voltage v eco 1.5 v collector current i c 20 ma power di ssipation p v 100 mw junction temperature t j 100 c operating temperature range t amb -40 to +100 c storage temperature range t stg -40 to +100 c soldering temperature acc. reflow profile fig. 9 t sd 260 c thermal resistance junction/ambient soldered on pcb with pad dimensions: 4 mm x 4 mm r thja 450 k/w
TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 2 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 1 - power dissipation limit vs. ambient temperature note ? each 3000 piece packing unit will co ntain a single group. th e label on the bag will indicate which binned group is in the bag. a specific group cannot be ordered. prod uction shipments containing multiple bags will likely include multiple groups. please design accordingly . 020406080 0 25 50 75 100 125 p v - power dissipation (mw) t amb - ambient temperature (c) 100 94 8308 r thja = 450 k/w basic characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit collector emitter breakdown voltage i c = 0.1 ma v ceo 6v collector dark current v ce = 5 v, e = 0 lx i ceo 350na collector emitte r capacitance v ce = 0 v, f = 1 mhz, e = 0 lx c ceo 16 pf photo current e v = 20 lx, cie illuminant a, v ce = 5 v i pce 4.6 a e v = 100 lx, cie illuminant a, v ce = 5 v i pce 7.5 23 39 a temperature coefficient of i pce cie illuminant a tk ipce 1.18 %/k led, white tk ipce 0.9 %/k angle of half sensitivity ? 60 deg wavelength of peak sensitivity p 550 nm range of spectral bandwidth 0.5 450 to 610 nm collector emitter sa turation voltage e v = 20 lx, 0.45 a v cesat 0.1 v type dedicated characteristics (t amb = 25 c, unless otherwise specified) parameter test condition binned group symbol min. max. unit photo current e v = 100 lx, cie illuminant a, v ce tz51 = 5 v ai pce 7.5 15 a bi pce 12 24 a ci pce 19.5 39 a
TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 3 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 basic characteristics (t amb = 25 c, unless otherwise specified) fig. 2 - collector dark current vs. ambient temperature fig. 3 - relative photo current vs. ambient temperature fig. 4 - photo current vs. illuminance fig. 5 - photo current vs. collector emitter voltage fig. 6 - collector emitter capacitance vs. collector emitter voltage fig. 7 - relative spectral sensitivity vs. wavelength 19758 100 80 60 40 20 0 -20 -40 t - ambient temperature (c) amb i - collector dark current (a) ceo 10 10 -6 -7 10 -8 10 -9 10 -10 10 -11 10 -12 10 -13 v ce = 5 v 19759 100 80 60 40 20 0 -20 -40 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 i pce rel - relative photo current t amb - ambient temperature (c) v ce = 5 v, white led 0.001 0.01 0.1 1 10 10 100 1000 10 000 20769 e v - illuminance (ix) i pce - photo current (ma) v ce = 5 v 0.01 0.1 1 10 012345 v ce - collector emitter voltage (v) i pse - photo current (ma) 100 lx 200 lx 500 lx 1 klx 3 klx 10 klx 20770 19762 f = 1 mhz c ce0 - collector emitter capacitance (pf) v ce - collector emitter voltage (v) 25 20 15 10 5 0 0.1 1.0 10.0 400 500 600 700 800 900 1000 1100 - wavelength (nm) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 s ( ) - relative spectral sensitivity rel 20116
TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 4 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 8 - relative radiant sensitivity vs. angular displacement reflow solder profile fig. 9 - lead (pb)-free reflow solder profile acc. j-std-020 drypack devices are packed in moistu re barrier bags (mbb) to prevent the products from mo isture absorption during transportation and storage. each bag contains a desiccant. floor life time between soldering and re moving from mbb must not exceed the time indicated in j-std-020: moisture sensitivity: level 3 floor life: 168 h conditions: t amb < 30 c, rh < 60 % drying in case of moisture absorpt ion devices should be baked before soldering. conditions see j-std-020 or label. devices taped on reel dry us ing recommended conditions 192 h at 40 c (+ 5 c), rh < 5 %. 0.4 0.2 0 s rel - relative sensitivity 94 8318 0.6 0.9 0.8 0 30 10 20 40 50 60 70 80 0.7 1.0 ? - angular displacement 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperature (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp up 3 c/s max. ramp down 6 c/s 19841 255 c
TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 5 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters 19757
TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 6 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 blister tape dimensions in millimeters 20690 quantity per reel: 3000 pcs
TEMT6200FX01 www.vishay.com vishay semiconductors rev. 1.9, 25-jun-14 7 document number: 81317 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 reel dimensions in millimeters of the wheel i s s upplier s pecific. form of the leave open i ss ue: 2; 26.04.10 drawing-no.: 9.800-5096.01-4 s pecification s according to din technical drawing s ? 177.8 max. ? 55 min. 8.4 +2.5 8.4 +0.15 14.4 max. ? 13 + 0.5 - 0.2 1.5 min. ? 20.2 min. z z 2:1 20875
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